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Various Manufacturers

Nanoindentation
System

High-resolution depth-sensing nanoindentation system for measuring hardness, elastic modulus, creep, and time-dependent properties of thin films, coatings, and bulk materials at the nanoscale.

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Nanoindentation System — Depth-Sensing Nanomechanical Testing

TESCAN IC-VM-029
★★★★★
5.0 — Nanoscale Mechanical Properties with Precision
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This nanoindentation system uses a diamond indenter to apply controlled loads at the nanometer scale and measures the resulting displacement with sub-nanometer resolution. From the load-displacement curve, hardness (H) and reduced elastic modulus (Er) are extracted using the Oliver-Pharr method, along with creep, relaxation, and elastic recovery parameters.

Sub-nm SEM Resolution
Dual-Beam System
3D Tomography
In-Situ Analysis
EDX / WDS / EBSD
Automated Workflows
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Warranty
1 Year Full
Installation
On-Site
Support
24/7 Technical

About the Nanoindentation System

Nanoindentation — also called depth-sensing indentation or instrumented indentation testing (IIT) — is the primary technique for measuring mechanical properties of thin films, coatings, and surface-modified materials where conventional hardness testing cannot be applied. By continuously recording load and displacement during the indentation cycle with sub-nanometer resolution, the technique extracts hardness (H) and reduced elastic modulus (Er) from the unloading segment of the load-displacement curve using the well-established Oliver-Pharr analysis framework.

The continuous stiffness measurement (CSM) mode superimposes a small oscillatory force on the primary loading signal, enabling continuous monitoring of hardness and modulus as a function of indentation depth — providing information about depth-dependent property gradients in coatings, case-hardened surfaces, and graded materials.

Automated mapping mode enables spatially resolved mechanical property measurements across user-defined grids on heterogeneous materials — generating hardness and modulus maps that correlate with microstructural features observed by SEM or optical microscopy.

Various Manufacturers Nanoindentation System Overview
Load Range< 1 µN – 500 mN (model dependent)
Load Resolution< 1 nN
Displacement Range0 – 20 µm
Displacement Resolution< 0.01 nm
IndentersBerkovich, cube corner, spherical, flat punch
ImagingIn-situ optical / SPM (model dependent)
ModesLoad control, displacement control, CSM, mapping
CSM Frequency1 Hz – 200 Hz
StageMotorized XY, 100×100 mm
EnvironmentAmbient, vacuum, fluid cell, heating (options)
SoftwareFull NI analysis, Oliver-Pharr, CSM hardness depth profiles
Vibration IsolationActive or passive (model dependent)
Thin Film & Coating
Hardness and modulus of PVD/CVD coatings, DLC films, and hard coatings on substrates.
Semiconductor Materials
Mechanical properties of dielectric, metallic, and polymeric films in IC fabrication.
Biomaterials
Nanomechanical properties of bone, cartilage, dental enamel, and tissue engineering scaffolds.
Structural Alloys
Phase-specific hardness and modulus mapping in multiphase metals and composites.
Polymer Films
Viscoelastic properties, creep compliance, and storage modulus of polymer coatings.
Geomaterials
Grain-level hardness and modulus of minerals and rocks for geomechanics research.
Nanoindentation System Main Frame
Diamond Berkovich Indenter
Motorized XY Sample Stage
Vibration Isolation System
Full Analysis Software License
Calibration Reference Materials (fused silica + aluminium)
Optical Microscope (in-situ)
PC & Monitor
On-Site Installation & Training
1-Year Warranty

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Various Manufacturers Nanoindentation System
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